Reactive gas molecules form what is known as plasma. The ions and electrons in plasma are used to remove unwanted organic contaminants. Unwanted particles are removed through a vacuum system. This cleaning procedure creates an ideal sterilization process. In addition, plasma cleaning eliminates the need for expensive solvents since substrate surfaces can be cleaned via a chemical reaction within plasma molecules.
Utilizing plasma in semiconductor manufacturing has many benefits. Firstly, it creates an easy and convenient substrate cleaning method. Plasma cleaning is conducted in a contained chamber with multiple gas supplies and a vacuum. Duration and other parameters can be adjusted by the user to achieve a desired cleaning cycle. Substrate properties can be enhanced through this process by improving adhesion and wettability and increasing surface energy.
How it works:
The color of plasma can indicate which type of reactive gas is being used to form plasma. For instance, a purple color is created when introducing Nitrogen into the chamber. Check out the video below to view a cycle of plasma treatment with Nitrogen and Oxygen:
The substrates within the chamber are being cleaned through the purple gas. This purple plasma is removing organic contaminants from the surface.