Micro-patterning is commonly done through masking. Creating a photomask involves important specifications that can directly affect a resulting pattern transfer. Mask material, environmental conditions, and type of resist should be considered. But prior to processing, photomask design characteristics must be determined.
During the photolithography process, thin film interference effects can influence a substrates surface properties. Common interference effects include the standing wave effect, reflective notching, edge bead formation, and under/over baking. The Platypus Technologies engineers have enhanced our standard operating procedures to account for potential defects caused by thin film interference effects.