A common problem that can occur during photolithography fabrication is adhesion of the photoresist to the substrate. A photoresist consists of a resin, sensitizer, adhesion promoter, and a thinner. Each component contributes to the overall photoresist properties. A resin is included to withstand an etchant solution that may be used in the later stages of fabrication. A sensitizer offers a photosensitive element to the resist that allows it to be exposed in certain areas and not in others. A thinner is included to modify the viscosity of the overall photoresist and make it easier to spin-coat onto the substrate. The included adhesion promoter is often not potent enough to provide enough strength between resist and substrate material.
In semiconductor fabrication, stencil metal plates or shadow masks can be used to designate where a metal is deposited upon a substrate. The stencil serves as a medium for achieving custom designs onto a substrate without the need for photolithography processes. This works by masking certain areas of a substrate while exposing others to be deposited with metal.
Internet of things (IoT) encompasses physical things that connect and exchange data with other technology. IoT offers increased connectivity, cloud computing, machine learning, and advancements to AI. Emerging advancements in IoT include machine monitoring, wearable health monitoring, inventory management, and public safety enhancements. IoT works through device-to-device communications that is conducted through sensor technology and actuators.
You might be thinking a cleanroom refers to an organized and tidy space. However, a certified cleanroom is much more than that. A cleanroom is a space for conducting operations that are sensitive the particle contamination, such as semiconductor fabrication. Enviornmental factors are altered in order to provide a controlled clean atmosphere. Airborne particles are filtered out while temperature, humidity, and air flow are regulated.
Platypus Technologies offers a customizable dicing service for a range of substrate materials. Accommodations can be made for both silicon wafers and glass substrates. Substrates are scribed, and then broken into individual pieces. Well-defined scribing lines are made with a diamond finished scribing wheel. This process does not involve heat therefore prevents any potential damage to a substrate material.
Creating a patterned metal on a substrate can be done through various methods. Metal lift-off represents just one fabrication method that entails three steps: 1) patterning a photosensitive polymer film onto the target substrate, 2) metal deposition onto the patterns polymer film, and 3) removal of polymer with a solvent.
As more advancements are made in the electronics industry, thin-film metal coatings remain in high demand. The team at Platypus Technologies has done custom work with a range of companies, from completing small R&D projects to creating continual partnerships. Our credibility has been built based on our internal expertise, high-quality metal deposition, and attention to detail.
Reactive gas molecules form what is known as plasma. The ions and electrons in plasma are used to remove unwanted organic contaminants. Unwanted particles are removed through a vacuum system. This cleaning procedure creates an ideal sterilization process. In addition, plasma cleaning eliminates the need for expensive solvents since substrate surfaces can be cleaned via a chemical reaction within plasma molecules.
Ultra-flat gold films by Platypus Technologies are created via electron-beam metal deposition under ultra-high vacuum conditions. Our gold films have a uniform orientation (Au(111)), high purity, and low surface roughness.
Platypus Technologies offers electron beam metal deposition services and expertise equip with handling custom projects. Our operations prioritize metal purity and smoothness. In order to create high quality metal coatings, each step involved in the process is carefully executed.
Automation and Robotics Allow for Higher Precision in Industrial Fluid Dispensing Applications
Precision fluid dispensing systems are utilized in a range of advanced manufacturing applications. At Platypus Technologies, we employ advanced fluid dispensing technology in our biosensor and bioassay fabrication processes, as well as in our conformal coating solutions.
Photolithography is a fabrication process used in the production of patterned thin films for precision applications such as microelectronics, biosensors, and custom patterned electrodes. The process utilizes ultraviolet (UV) light to expose a minutely detailed pattern within a light-sensitive photoresist coating.
The coating is deposited on a substrate material and a mask is placed atop the photoresist. UV light therefore interacts only with the areas of the photoresist that are left exposed underneath the mask. Once the mask is removed, a precise geometric pattern remains on the substrate surface, formed via exposure to the UV light.
How Thin Film Deposition Works – Its Advantages and Applications
Thin metal film deposition is a unique fabrication process commonly used in the manufacturing of semiconductors, biosensors, and other specialized photolithography applications.
The process involves carefully depositing thin metallic film coating onto a substrate in order to yield specific material properties. For example, specially engineered thin film coatings are used in the fields of optics and imaging to modify the optical properties of glass. In more advanced biomedical and semiconductor applications, thin film deposition is used to create specific molecular properties in the conducting material, further paving the way for highly customizable chip manufacturing.
Cutting-Edge Engineering Developments in the Biosensor Polymer Manufacturing Industry
Recently, a novel organic semiconducting material was engineered which has the potential to push next-generation biosensor development to new heights. This innovative new carbon-based semiconductor polymer was specifically developed to surpass current biosensor options in sensing performance, reliability, as well as overall biocompatibility.
Biosensors are the core component of many cutting-edge technological initiatives – from state-of-the-art healthcare devices to the agricultural and industrial manufacturing sectors.
Interdigitated electrodes (IDEs) are fabricated through the process of combining two separately addressable electrode arrays, such that the resulting electrode structure is infused in a zipper-like or comb-shaped arrangement.
The fundamental process of creating integrated circuits (ICs) is dependent on pattern transfer techniques encompassed in photolithography. The IC industry relies on three main processes: metal deposition, patterning, and selective doping.
Photolithography techniques are used heavily in the integrated circuit industry. New industry standards have created a need for creating smaller features that enable lower power consumption.
Characterizing and testing biological samples can be done through patterned electrodes. The overall structure and quality of an electrode can either enhance or impinge on sampling results. An ideal electrode design should attain a high signal-to-noise ratio (SNR), a low electrode impedance, and display resistance to harsh biological environments. Current generation and transportation depend on the metal coating present on an electrode surface.
Micro-patterning is commonly done through masking. Creating a photomask involves important specifications that can directly affect a resulting pattern transfer. Mask material, environmental conditions, and type of resist should be considered. But prior to processing, photomask design characteristics must be determined.