Thermal Oxide Wafer Coated with Gold


Substrate: Prime Grade Thermal oxide silicon Wafer (100-mm dia., 525-µm thick)

Oxide Thickness: 285-nm +/- 5%

Metal Layer: Gold, 50-nm

Gold Purity: 99.999%

Adhesion Layer: Titanium, 2.5-nm

Quantity: One (1) gold-coated thermal oxide silicon wafer

SKU: AU.0500.TO Categories: ,


Ideal for fabrication for sensors, biosensors and electrodes via photolithography and wet etching techniques.