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$349.00
Substrate: Prime Grade Thermal oxide silicon Wafer (100-mm dia., 525-µm thick)
Oxide Thickness: 285-nm +/- 5%
Metal Layer: Gold, 50-nm
Gold Purity: 99.999%
Adhesion Layer: Titanium, 2.5-nm
Quantity: One (1) gold-coated thermal oxide silicon wafer
Ideal for fabrication for sensors, biosensors and electrodes via photolithography and wet etching techniques.