Description
High purity gold (99.999%) exhibits high electrical conductivity and high reflectivity.
Our gold coated wafers feature a thin titanium adhesion layer to ensure proper adhesion of the gold layer to the silicon substrate.
This product can be used as a substrate for analytical characterization of thin films, nanoparticles, proteins and self-assembled monolayers via electrochemistry, IR spectroscopy, Raman spectroscopy, X-ray spectroscopy, or ellipsometry.
Gold-coated wafers are also ideal substrates for fabrication of complex electrochemical devices.