Description
Silicon wafer coated with high purity gold (99.999%) exhibits high electrical conductivity and high reflectivity. Our gold coated wafers feature a thin titanium adhesion layer to ensure proper adhesion of the gold layer to the silicon substrate.
This product can be used as a substrate for analytical characterization of thin films, nanoparticles, proteins and self-assembled monolayers via electrochemistry, IR spectroscopy, Raman spectroscopy, X-ray spectroscopy, or ellipsometry. Gold-coated wafers are also ideal substrates for fabrication of complex electrochemical devices.
Gold-coated silicon wafers, and gold-coated silicon chips, are used extensively as substrates for analytical characterization of materials. For example, materials deposited onto gold-coated wafers can be analized via ellipsometry, Raman spectroscopy or infrared (IR) spectroscopy due to the high-reflectivity and favorable optical properties of gold. In addition, gold-coated silicon wafers are excellent substrates for fabricating electrodes, electrochemical sensors, self-assembled monolayers, photonic devices, and other advanced technologies.
selected publications
- Fabrication of photoelectric devices (link).
- Characterization of de-salination membranes (link).
- XPS measurements of molecular sieves (link).
- Molecular force spectroscopy of SAMs (link).
- Fabrication of chemically patterned surfaces (link).
Related product: Gold-coated silicon chips
Platypus Technologies has capabilities to deposit gold via e-beam evaporation onto a variety of substrates including glass, thermal oxide wafers, ITO, flexible substrates and many others. Contact us to request a quotation for a custom gold-coated product to fit your needs.
