Silicon Wafers with 100 nm Gold (1 wafer)


Product Details:

Substrate Material: Prime Grade Silicon Wafer

-4” Diameter

-Thickness: 525 um

Metal Deposited: Au (111)

      Thickness: 100-nm

Adhesion layer: Titanium

     Thickness: 5-nm

Our gold coated Silicon wafers feature a thin Titanium adhesion layer to ensure proper substrate to metal adhesion. Gold is an excellent metal due to its electronic properties and planarity. This product can be used in a range of applications requiring highly sensitive measurements.


  • Electronics: Nanoelectrons, Microelectronics
  • Precision Imaging: AFM, IR Spectroscopy
  • Technology: Nanotech, Biotech, Nanoimprinting
  • Chemistry: Electrochemistry
SKU: AU.1000.SL0 Categories: ,