Custom Dicing Service

Platypus Technologies offers a customizable dicing service for a range of substrate materials. Accommodations can be made for both silicon wafers and glass substrates. Substrates are scribed, and then broken into individual pieces. Well-defined scribing lines are made with a diamond finished scribing wheel. This process does not involve heat therefore prevents any potential damage to a substrate material. 

Creating patterns through Metal Lift-off

Creating a patterned metal on a substrate can be done through various methods. Metal lift-off represents just one fabrication method that entails three steps: 1) patterning a photosensitive polymer film onto the target substrate, 2) metal deposition onto the patterns polymer film, and 3) removal of polymer with a solvent.  

Thin-film Metal Coatings

As more advancements are made in the electronics industry, thin-film metal coatings remain in high demand. The team at Platypus Technologies has done custom work with a range of companies, from completing small R&D projects to creating continual partnerships. Our credibility has been built based on our internal expertise, high-quality metal deposition, and attention to detail.  

What is Plasma Cleaning?

Reactive gas molecules form what is known as plasma. The ions and electrons in plasma are used to remove unwanted organic contaminants. Unwanted particles are removed through a vacuum system. This cleaning procedure creates an ideal sterilization process. In addition, plasma cleaning eliminates the need for expensive solvents since substrate surfaces can be cleaned via a chemical reaction within plasma molecules.  

Biological Testing with Patterned Electrodes

Characterizing and testing biological samples can be done through patterned electrodes. The overall structure and quality of an electrode can either enhance or impinge on sampling results. An ideal electrode design should attain a high signal-to-noise ratio (SNR), a low electrode impedance, and display resistance to harsh biological environments. Current generation and transportation depend on the metal coating present on an electrode surface.

Thin Film Interference Effects

During the photolithography process, thin film interference effects can influence a substrates surface properties. Common interference effects include the standing wave effect, reflective notching, edge bead formation, and under/over baking. The Platypus Technologies engineers have enhanced our standard operating procedures to account for potential defects caused by thin film interference effects.

Photolithography based Lift-off

Lift-off is often conducted following a series of photolithography steps that create a photoresist layer onto a substrate. Chemical and metal lift-off methods are used to create distinctive patterns onto a surface. Both types of lift-offs can be time consuming compared to wet etching, however lift-off is a safer method that offers lower production costs and enhanced processing capabilities.

Wet Etching

Wet etching is a technique to pattern metal films into functional devices. A metal film covered with a patterned photoresist is submerged into a liquid that selectively removes exposed areas of the metal.  This form of etching is an isotropic method, meaning that the metal is removed with equal rate all directions.