Thin Film Interference Effects

During the photolithography process, thin film interference effects can influence a substrates surface properties. Common interference effects include the standing wave effect, reflective notching, edge bead formation, and under/over baking. The Platypus Technologies engineers have enhanced our standard operating procedures to account for potential defects caused by thin film interference effects.

Photolithography based Lift-off

Lift-off is often conducted following a series of photolithography steps that create a photoresist layer onto a substrate. Chemical and metal lift-off methods are used to create distinctive patterns onto a surface. Both types of lift-offs can be time consuming compared to wet etching, however lift-off is a safer method that offers lower production costs and enhanced processing capabilities.

Wet Etching

Wet etching is a technique to pattern metal films into functional devices. A metal film covered with a patterned photoresist is submerged into a liquid that selectively removes exposed areas of the metal.  This form of etching is an isotropic method, meaning that the metal is removed with equal rate all directions.